Multi-core architecture is the mainstream microprocessor design methodology, butit is facing the challenging Memory Wall problems. With the increasing number of coresandthreadsonchips,thebandwidthandperformanceofthememoryhavebecomethebot-tleneck.The three dimensional integrated circuits (3D IC) technology is a new integratedprocess, which can connect many dies with TSVs to increase the on-chip silicon resourceand shorten wires to increase the on-chip memory resource and
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